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RMD Vision for Tomorrow
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IC magnetic field image; resolution 13 x 120 microns
PCB test with basic magnetic image
PCB test with basic magnetic image
Silicon trench and defect location
CPU with trenches for IR inspection
Imaging current flow on different layers of a PCB
Imaging current flow on different layers of a PCB
Enlargement
Locating a 26 x 62 micron defect in an IC
Locating a 26 x 62 micron defect
in an IC

Instrumentation Group at RMD

The Advanced Instrumentation Division is focused on the development of solid-state, magnetic field sensors and sensor arrays, and applications for those sensors in nondestructive inspection (NDI), in-circuit testing, anti-tampering for integrated circuits, and biomedical applications.

Research Areas:

Nondestructive Inspection of Metal Components

In-Circuit Testing for Integrated Circuits

NDI of Metallic Components

RMD has developled the following sensors:

Solid-state Sensors and Sensor Arrays
-----Sensors and sensor arrays made from magnetoresistive materials that are 106 times more sensitive than coil-based sensors   

Nondestructive Evaluation - Metallic Components
-----Solid-state magnetic field sensors that can be used to detect induced eddy currents in metallic structures, as well as for a wide range of eddy current testing (ECT) applications.

Magnetic Imaging
-----Sensor arrays which permit the formation of magnetic images, allowing the detection and analysis of defects in metals.

Second Layer Defect Detection
-----Magnetic imaging can detect flaws and corrosion that are deeply buried in a metal, or hidden by paint and overlying layers of metal.

Stand-off Detection
-----Based on magnetic imaging, RMD can image defects without immediate contact with a part.

Portable Defect Detection and Imaging
-----RMD offers a portable instrument that can be easily carried by an inspector.

Replacement of Coil-Based Eddy Current Sensors
-----Solid-state sensors made by RMD can be used as direct replacement of coil-based sensors used in existing ECT equipment, increasing sensitivity.

Aging and Prognostics
-----Improved defect and image analysis techniques allowing the study of defect propagation due to aging, and prognostics for replacement of components before they fail in the field. 

more information

Inspection of Integrated Circuits (ICs)

Imaging and Location of Manufacturing Faults in ICs
-----Revolutionary new technologies for integrated circuit manufacture and process control. Images of electric currents and magnetic fields in ICs make possible the location of defects related to the IC fabrication process.

Improved Manufacturing Yield
-----Pin point resolution of defects helps identify where in the manufacturing process changes must be made to increase yield. 

In Circuit Test-Automated Test Equipment
----- Can determine the voltage, frequency and current in real time at any and all nodes in a circuit without contact.

Curve-Tracer
-----Replace the traditional curve-tracer with a portable instrument that can measure current voltage and frequency on any IC pin, or passive components on a PCB in real-time. 

Dynamic testing
-----Performs non-contact nodal analysis of all circuit components on a printed circuit board.

""Magnetic Vision System for IC Inspection

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